Osaka Sealing Printing Co., Ltd. will be exhibiting at TOKYO PACK 2018. This exhibition is one of the world's leading international comprehensive packaging exhibitions, covering all fields from procurement to production, logistics, distribution, sales, consumption, disposal and recycling, with a focus on packaging materials, containers and packaging machinery that are used in a variety of industries.

Osaka Sealing Printing Co., Ltd. will be introducing the Clear Thermal Series (seals, hanging paper, heat-sealed packaging) that allows direct thermal printing on transparent materials, as well as exhibiting a number of noteworthy labelers, including the newly designed new Clear Thermal Wrapping mounting machine FWS-KS-W and the clear thermal band mounting machine FWB-50.
Also, on the main stage, we will be demonstrating the printing, pasting and mounting of clear thermal labels using the new FWS-KS-W, LA-8SERIES Top-bottom pasting machine, and FWB-50. Please come to our booth with your friends.

■ Exhibits:
・Labeling system
FWS-KS-W (Clear Thermal Wrapping mounting machine)
LA-8SERIES Top-bottom pasting machine (with printer)
FWB-50 (clear thermal band mounting machine)
FD-350TP (Clear Thermal Dispenser)
LA-55HSB (Cylinder 2-sheet pasting machine)
Robot-mounted labeler
・Clear Thermal Series
Clear thermal seal, Clear Thermal Wrapping, clear thermal band
・Stickers and labels
Torn Japanese paper, etc.

■Date：Tuesday, October 2nd to Friday, October 5th, 2018
■Time：10:00～17:00
■Venue：Tokyo Big Sight [OSP Booth] East Hall 3, 3-46