Osaka Sealing Printing Co., Ltd. exhibited at TOKYO PACK 2018.
At the OSP booth, we introduced four film-related devices, including the newly designed Clear Thermal Wrapping mounting machine FWS-KS-W, as well as the clear thermal band mounting machine FWB-50, and five labelers.
The new FWS-KS-W can print on Clear Thermal Wrapping hanging paper while attaching it to a container, and the demonstration, which achieved both accurate printing and speed, attracted a lot of attention and was viewed by many people, and the event ended with great success. Thank you very much to everyone who visited.

■Dates: October 2nd (Tue) to 5th (Fri), 2018
■Venue: Tokyo Big Sight [OSP Booth] East Hall 3, 3-46